Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2025-09-30 |
| 12394758 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2025-08-19 |
| 12368280 | Semiconductor device and method | Chen-Hua Yu, An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Yu-Hung Lin +1 more | 2025-07-22 |
| 12347749 | Semiconductor packages | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2025-07-01 |
| 12341104 | Methods of manufacturing semiconductor devices | Yu-Hung Lin, An-Jhih Su, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2025-06-24 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2025-06-10 |
| 12327815 | Integrated circuit package and method of forming the same | Sung-Feng Yeh, Jian-Wei Hong | 2025-06-10 |
| 12322726 | Method of forming an integrated circuit package having a padding layer on a carrier | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Wei-Chih Lai | 2025-06-03 |
| 12211782 | Semiconductor package dielectric susbtrate including a trench | Yueh-Ting Lin, Hua-Wei Tseng, Ming-Shih Yeh | 2025-01-28 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Cheng-Hsien Hsieh, Li-Han Hsu +3 more | 2025-01-07 |