Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Chiang-Hung Lin, Ming-Shih Yeh | 2025-09-30 |
| 12211782 | Semiconductor package dielectric susbtrate including a trench | Yueh-Ting Lin, Ming-Shih Yeh, Der-Chyang Yeh | 2025-01-28 |