Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2025-09-30 |
| 12388047 | Integrated fan-out platform and manufacturing method for semiconductor devices | Hsueh-Lung Cheng, Yao-Chun Chuang, Yinlung Lu | 2025-08-12 |
| 12354946 | Delamination control of dielectric layers of integrated circuit chips | Jun He, Yao-Chun Chuang, Chih-Lin Wang, Shih-Kang Tien | 2025-07-08 |
| 12347749 | Semiconductor packages | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2025-07-01 |
| 12334465 | Semiconductor package and method of forming same | Yao-Chun Chuang, SyuFong Li, Ching-Pin Lin, Jun He | 2025-06-17 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2025-06-10 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo +2 more | 2025-06-03 |
| 12243833 | Semiconductor device with electromagnetic interference film and method of manufacture | Chi-Hsi Wu, Hsien-Wei Chen, Tien-Chung Yang | 2025-03-04 |