Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412805 | Semiconductor package | Chen-Hsiang Lao, Yuan Sheng Chiu, Hung-Chi Li, Shih-Chang Ku | 2025-09-09 |
| 12394754 | Device and method for UBM/RDL routing | Meng-Tsan Lee, Wei-Cheng Wu | 2025-08-19 |
| 12387988 | Method of manufacturing semiconductor package having lid structure | Wensen Hung, Tsung-Yu Chen | 2025-08-12 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Chin-Chuan Chang +5 more | 2025-06-10 |
| 12322727 | Device and method for UBM/RDL routing | Meng-Tsan Lee, Wei-Cheng Wu | 2025-06-03 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2025-01-07 |
| 12191239 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng | 2025-01-07 |