Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12320468 | Communication apparatus and bracket device thereof | Lan-Chun Yang, Chun-Hung Huang, Yi-Chieh Lin | 2025-06-03 |
| 12322726 | Method of forming an integrated circuit package having a padding layer on a carrier | Cheng-Hsien Hsieh, Wei-Cheng Wu, Der-Chyang Yeh, Wei-Chih Lai | 2025-06-03 |
| 12205866 | Semiconductor device | Chien-Chia Chiu | 2025-01-21 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2025-01-07 |
| 12191239 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Chien-Fu Tseng | 2025-01-07 |