Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417959 | Integrated circuit device cooling using thermoresponsive materials | Rebecca Shia | 2025-09-16 |
| 12387988 | Method of manufacturing semiconductor package having lid structure | Tsung-Shu Lin, Wensen Hung | 2025-08-12 |
| 12354927 | Semiconductor device | Wensen Hung, Yih-Ting Shen, Jia-Syuan Li | 2025-07-08 |
| 12272612 | Semiconductor package module and manufacturing methods thereof | Wensen Hung | 2025-04-08 |
| 12191239 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Li-Han Hsu, Chien-Fu Tseng | 2025-01-07 |