Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387988 | Method of manufacturing semiconductor package having lid structure | Tsung-Shu Lin, Tsung-Yu Chen | 2025-08-12 |
| 12354927 | Semiconductor device | Yih-Ting Shen, Jia-Syuan Li, Tsung-Yu Chen | 2025-07-08 |
| 12272612 | Semiconductor package module and manufacturing methods thereof | Tsung-Yu Chen | 2025-04-08 |