Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322726 | Method of forming an integrated circuit package having a padding layer on a carrier | Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Wei-Chih Lai | 2025-06-03 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +3 more | 2025-01-07 |