Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431417 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2025-09-30 |
| 12368280 | Semiconductor device and method | Chen-Hua Yu, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh, Yu-Hung Lin +1 more | 2025-07-22 |
| 12347749 | Semiconductor packages | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2025-07-01 |
| 12341104 | Methods of manufacturing semiconductor devices | Yu-Hung Lin, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2025-06-24 |
| 12327819 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2025-06-10 |
| 12283492 | Photonic integrated package and method forming same | Chen-Hua Yu, Wei-Yu Chen | 2025-04-22 |
| 12266633 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-04-01 |
| 12218104 | Method for forming chip package structure with molding layer | Wei-Yu Chen | 2025-02-04 |