Issued Patents 2025
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412802 | Heat dissipation structures for integrated circuit packages and methods of forming the same | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang | 2025-09-09 |
| 12368084 | Package structure and manufacturing method thereof | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang, Szu-Wei Lu | 2025-07-22 |
| 12368090 | Method of manufacturing semiconductor device including passivation layer | Jing-Cheng Lin, Po-Hao Tsai | 2025-07-22 |
| 12362260 | Methods of packaging semiconductor devices and packaged semiconductor devices | Po-Hao Tsai, Jing-Cheng Lin | 2025-07-15 |
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2025-05-13 |
| 12278162 | Coplanar control for film-type thermal interface | Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Szu-Wei Lu | 2025-04-15 |
| 12266633 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, An-Jhih Su, Szu-Wei Lu | 2025-04-01 |
| 12237291 | Dummy structure of stacked and bonded semiconductor device | Po-Hao Tsai, Jing-Cheng Lin | 2025-02-25 |
| 12230609 | Semiconductor packages | Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu | 2025-02-18 |
| 12224224 | Package structure with metallic layer over the surfaces of a plurality of semiconductor dies | Chih-Hao Chen, Po-Yuan Cheng, Pu Wang | 2025-02-11 |
| 12218117 | Method of forming package structure and package structure therefrom | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2025-02-04 |
| 12211818 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Szu-Wei Lu | 2025-01-28 |