Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Yu-Sheng Lin, Tsung-Yang Hsieh, Jyun-Lin Wu, Yao-Chun Chuang | 2025-09-23 |
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2025-05-13 |
| 12293951 | Semiconductor package structure having ring portion with recess for adhesive | Hui-Ting Lin, Chen-Shien Chen | 2025-05-06 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12272663 | Metal-bump sidewall protection | Jung-Hua Chang, Jian-Yang He | 2025-04-08 |
| 12230609 | Semiconductor packages | Chih-Yuan Chien, Li-Hui Cheng, Szu-Wei Lu | 2025-02-18 |
| 12218117 | Method of forming package structure and package structure therefrom | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2025-02-04 |