Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368132 | Joint structure in semiconductor package and manufacturing method thereof | Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2025-07-22 |
| 12362196 | Package structure with underfill | Sung-Hui Huang, Jui Hsieh Lai, Shang-Yun Hou | 2025-07-15 |
| 12327781 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu +1 more | 2025-06-10 |
| 12315786 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu +1 more | 2025-05-27 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2025-05-06 |
| 12253729 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2025-03-18 |
| 12237288 | Semiconductor die package and method of manufacture | Sung-Hui Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang, Wen-Yao Chang +1 more | 2025-02-25 |