Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424587 | Semiconductor device having underfill surrounding bottom package and solder ball | Jing-Cheng Lin, Pu Wang, Chen-Hua Yu | 2025-09-23 |
| 12381177 | Package structure and method of fabricating the same | Kung-Chen Yeh, Szu-Wei Lu, Tsung-Fu Tsai | 2025-08-05 |
| 12368123 | Package structure including stacked pillar portions and method for fabricating the same | Jung-Hua Chang, Szu-Wei Lu | 2025-07-22 |
| 12368132 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Cheng-Chieh Li | 2025-07-22 |
| 12362245 | Package assembly including a package lid having an inner foot and methods of making the same | Tsung-Fu Tsai, Pu Wang, Szu-Wei Lu | 2025-07-15 |
| 12347739 | Package structure | Chih-Wei Wu, Wen-Chih Chiou | 2025-07-01 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ting-Yu Yeh +1 more | 2025-04-08 |
| 12230605 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2025-02-18 |