Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412841 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu | 2025-09-09 |
| 12387997 | Semiconductor packages | Yi-Jung Chen, Wei-An Tsao, Szu-Wei Lu | 2025-08-12 |
| 12381177 | Package structure and method of fabricating the same | Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2025-08-05 |
| 12368128 | Device bonding apparatus and method of manufacturing a package using the apparatus | Yi-Jung Chen, Szu-Wei Lu | 2025-07-22 |
| 12362245 | Package assembly including a package lid having an inner foot and methods of making the same | Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2025-07-15 |
| 12353011 | Photonic package and method of manufacture | Hsing-Kuo Hsia, Szu-Wei Lu, Chen-Hua Yu | 2025-07-08 |
| 12347708 | Inspection apparatus, manufacturing method of integrated circuit, and inspection method | Szu-Wei Lu | 2025-07-01 |
| 12315806 | Electronic device and manufacturing method thereof | Hou-Ju Huang, Shih-Ting Lin, Szu-Wei Lu, Hung-Wei Tsai | 2025-05-27 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih, Ting-Yu Yeh +1 more | 2025-04-08 |