Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387997 | Semiconductor packages | Wei-An Tsao, Tsung-Fu Tsai, Szu-Wei Lu | 2025-08-12 |
| 12368128 | Device bonding apparatus and method of manufacturing a package using the apparatus | Tsung-Fu Tsai, Szu-Wei Lu | 2025-07-22 |