Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400989 | Arrangement of power-grounds in package structures | Chun Hua Chang, Fong-Yuan Chang, Jyh Chwen Frank Lee | 2025-08-26 |
| 12334464 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2025-06-17 |
| 12327781 | Semiconductor structure and manufacturing method thereof | Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more | 2025-06-10 |
| 12315786 | Semiconductor structure and manufacturing method thereof | Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more | 2025-05-27 |
| 12272568 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih +1 more | 2025-04-08 |