Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
KT

Kuo-Chiang Ting

TSMC: 11 patents #221 of 3,957Top 6%
Overall (2025): #4,973 of 469,880Top 2%
11
Patents 2025

Issued Patents 2025

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12400878 Integrated circuit package and method Shih-Ting Lin, Szu-Wei Lu, Shang-Yun Hou, Chi-Hsi Wu, Weiming Chris Chen 2025-08-26
12392961 Structure and process for photonic packages Chen-Hua Yu, Hsing-Kuo Hsia 2025-08-19
12362291 Semiconductor device and method Sung-Feng Yeh, Ta Hao Sung, Ming-Zhi Yang, Gao-Long Wu 2025-07-15
12334464 Encapsulated package including device dies connected via interconnect die Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh 2025-06-17
12327781 Semiconductor structure and manufacturing method thereof Ting-Yu Yeh, Ching-He Chen, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more 2025-06-10
12322729 Semiconductor device Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou, Chi-Hsi Wu 2025-06-03
12322673 3DIC with heat dissipation structure and warpage control Sung-Feng Yeh, Ta Hao Sung, Jian-Wei Hong 2025-06-03
12315786 Semiconductor structure and manufacturing method thereof Ting-Yu Yeh, Ching-He Chen, Weiming Chris Chen, Chia-Hao Hsu, Kuan-Yu Huang +1 more 2025-05-27
12259578 Photonic semiconductor device and method of manufacture Hsing-Kuo Hsia, Chen-Hua Yu, Shang-Yun Hou 2025-03-25
12253729 Optical transceiver and manufacturing method thereof Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou +1 more 2025-03-18
12242108 Photonic semiconductor device and method of manufacture Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu 2025-03-04