Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334464 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh | 2025-06-17 |
| 12327781 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Kuan-Yu Huang +1 more | 2025-06-10 |
| 12315786 | Semiconductor structure and manufacturing method thereof | Ting-Yu Yeh, Ching-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Kuan-Yu Huang +1 more | 2025-05-27 |
| 12300573 | Semiconductor device and manufacturing method thereof | Bo-Jiun Yang, Wen-Sung Hsu, Tai-Yu Chen, Sheng-Liang Kuo | 2025-05-13 |
| 12261151 | Integrated circuit packages | Yung-Chi Lin, Wen-Chih Chiou | 2025-03-25 |