Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374651 | Wafer bonding method | Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2025-07-29 |
| 12374655 | Method of forming package structure by using a wafer chuck with adjustable curved surface | Wen-Chih Chiou, Yen-Ming Chen | 2025-07-29 |
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2025-06-03 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai | 2025-04-01 |
| 12261151 | Integrated circuit packages | Chia-Hao Hsu, Wen-Chih Chiou | 2025-03-25 |