Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374651 | Wafer bonding method | Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2025-07-29 |
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2025-06-03 |
| 12276838 | Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Wen-Chih Chiou, Chen-Hua Yu | 2025-04-15 |
| 12278203 | Semiconductor structure and manufacturing method thereof | Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou | 2025-04-15 |
| 12249566 | 3DIC with gap-fill structures and the method of manufacturing the same | Ping-Jung Wu, Ken-Yu Chang, Hao-Wen Ko | 2025-03-11 |
| 12237284 | Semiconductor structure comprising dummy feature interposed between the bonding connectors | Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou | 2025-02-25 |