Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387996 | Through-substrate vias with improved connections | Jing-Cheng Lin | 2025-08-12 |
| 12366004 | Apparatus and method for wafer pre-wetting | Chen-Yu Tsai, Wen-Chih Chiou | 2025-07-22 |
| 12362315 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Wen-Chih Chiou, Ming-Tsu Chung | 2025-07-15 |
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2025-06-03 |
| 12278203 | Semiconductor structure and manufacturing method thereof | Chen-Yu Tsai, Tsang-Jiuh Wu, Wen-Chih Chiou | 2025-04-15 |
| 12237284 | Semiconductor structure comprising dummy feature interposed between the bonding connectors | Chen-Yu Tsai, Tsang-Jiuh Wu, Wen-Chih Chiou | 2025-02-25 |
| 12227867 | Plating apparatus for plating semiconductor wafer and plating method | Chen-Yu Tsai, Wen-Chih Chiou | 2025-02-18 |