Issued Patents 2025
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424587 | Semiconductor device having underfill surrounding bottom package and solder ball | Ying-Ching Shih, Pu Wang, Chen-Hua Yu | 2025-09-23 |
| 12387996 | Through-substrate vias with improved connections | Ku-Feng Yang | 2025-08-12 |
| 12382630 | Semiconductor assemblies including combination memory and methods of manufacturing the same | — | 2025-08-05 |
| 12371790 | Wafer carrier with adjustable alignment devices and deposition equipment using the same | Yu-Te Shen | 2025-07-29 |
| 12368090 | Method of manufacturing semiconductor device including passivation layer | Li-Hui Cheng, Po-Hao Tsai | 2025-07-22 |
| 12362260 | Methods of packaging semiconductor devices and packaged semiconductor devices | Li-Hui Cheng, Po-Hao Tsai | 2025-07-15 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jiun-Ren Lai, Yung-Chi Lin | 2025-04-01 |
| 12249581 | Method of manufacture overlay mark using laser marking process for semiconductor device | Chen-Hua Yu, Po-Hao Tsai | 2025-03-11 |
| 12237238 | Package structure and method | Szu-Wei Lu, Chen-Hua Yu | 2025-02-25 |
| 12237291 | Dummy structure of stacked and bonded semiconductor device | Li-Hui Cheng, Po-Hao Tsai | 2025-02-25 |
| 12198904 | Thin-film-deposition equipment | Yu-Te Shen | 2025-01-14 |
| 12191287 | Package structure | Po-Hao Tsai | 2025-01-07 |