Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Yushun Lin, Heh-Chang Huang +8 more | 2025-05-06 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2025-04-01 |
| 12243824 | Semiconductor devices and methods of manufacture | Shang-Yun Hou | 2025-03-04 |