Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347817 | Semiconductor device package having warpage control | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2025-07-01 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12261125 | Method for forming chip package structure | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2025-03-25 |