Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412827 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Kuo-Ching Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-09 |
| 12368092 | Package substrate insulation opening design | Shu-Jung Tseng | 2025-07-22 |
| 12354884 | Method for making a packaging substrate | Kuo-Ching Hsu | 2025-07-08 |
| 12354928 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shin-Puu Jeng | 2025-07-08 |
| 12347817 | Semiconductor device package having warpage control | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2025-07-01 |
| 12300632 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-05-13 |
| 12261125 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2025-03-25 |
| 12230593 | Wafer level package with polymer layer delamination prevention design and method of forming the same | Kai-Heng CHEN, Pei-Haw Tsao, Rung-De Wang, Chien-Chun Wang | 2025-02-18 |