Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
ST

Shu-Jung Tseng

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Zhumaoya, TW: #11 of 21 inventorsTop 55%
Overall (2025): #215,207 of 469,880Top 50%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12368092 Package substrate insulation opening design Shyue-Ter Leu 2025-07-22