Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412827 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-09 |
| 12388003 | Chip package structure with metal-containing layer | Yu-Huan Chen, Chen-Shien Chen | 2025-08-12 |
| 12354884 | Method for making a packaging substrate | Shyue-Ter Leu | 2025-07-08 |