Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412827 | Semiconductor die package with conductive line crack prevention design | Shu-Shen Yeh, Kuo-Ching Hsu, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-09 |
YL
Ya Huei Lee
Overall (2025): #166,898 of 469,880Top 40%
1
Patents 2025