Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Che-Chia Yang +2 more | 2025-07-22 |
| 12327782 | Systems for semiconductor package mounting with improved co-planarity | Wen-Yi Lin, Chien-Chen Li, Chen-Shien Chen | 2025-06-10 |
| 12300632 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2025-05-13 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-04-22 |