Issued Patents 2025
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417970 | Method for forming chip package structure | Chin-Hua Wang, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-09-16 |
| 12394752 | Multi-chip device and method of formation | Chin-Hua Wang, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12374636 | Semiconductor device package with stress reduction design | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-07-29 |
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Kuang-Chun Lee, Che-Chia Yang +2 more | 2025-07-22 |
| 12368127 | Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12362256 | Method for forming semiconductor package structure | Ming-Chih Yew, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-07-15 |
| 12341091 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Ming-Chih Yew, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-06-24 |
| 12334451 | Semiconductor package including package substrate with dummy via and method of forming the same | Chin-Hua Wang, Chun-Wei Chen, Shin-Puu Jeng | 2025-06-17 |
| 12322666 | Package assembly lid and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-05-27 |
| 12308346 | Semiconductor die with tapered sidewall in package | Chin-Hua Wang, Shin-Puu Jeng, Po-Yao Lin, Shu-Shen Yeh, Ming-Chih Yew +1 more | 2025-05-20 |
| 12266635 | Semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-04-01 |
| 12261102 | Semiconductor package and method of forming the same | Li-Ling Liao, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2025-03-25 |
| 12255078 | Semiconductor devices and methods of manufacturing | Ming-Chih Yew, Po-Yao Lin, Chien-Sheng Chen, Shin-Puu Jeng | 2025-03-18 |
| 12255156 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-03-18 |
| 12237276 | Package structure | Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh, Po-Yao Lin +1 more | 2025-02-25 |