Issued Patents 2025
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431415 | Buffer block structures for C4 bonding and methods of using the same | Li-Ling Liao, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-09-30 |
| 12424511 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-09-23 |
| 12417970 | Method for forming chip package structure | Chin-Hua Wang, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-09-16 |
| 12394698 | Underfill cushion films for packaging substrates and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12368114 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12347758 | Dual-underfill encapsulation for packaging and methods of forming the same | Jing-Ye Juang, Ming-Chih Yew, Hsien-Wei Chen, Shin-Puu Jeng | 2025-07-01 |
| 12347764 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-01 |
| 12341091 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Ming-Chih Yew, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-06-24 |
| 12322666 | Package assembly lid and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-06-03 |
| 12322703 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-05-27 |
| 12300568 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-05-13 |
| 12249568 | Metallization structure | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-03-11 |
| 12237277 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-02-25 |