Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387945 | Semiconductor structures including glass core layer and methods of forming the same | Hsien-Wei Chen, Shin-Puu Jeng | 2025-08-12 |
| 12347758 | Dual-underfill encapsulation for packaging and methods of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Hsien-Wei Chen, Shin-Puu Jeng | 2025-07-01 |