Issued Patents 2025
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431415 | Buffer block structures for C4 bonding and methods of using the same | Li-Ling Liao, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-30 |
| 12412851 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2025-09-09 |
| 12406936 | Semiconductor package with substrate recess and methods for forming the same | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12406897 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12394698 | Underfill cushion films for packaging substrates and methods of forming the same | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12368114 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12368127 | Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall | Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12362256 | Method for forming semiconductor package structure | Po-Chen Lai, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-07-15 |
| 12347758 | Dual-underfill encapsulation for packaging and methods of forming the same | Jing-Ye Juang, Chia-Kuei Hsu, Hsien-Wei Chen, Shin-Puu Jeng | 2025-07-01 |
| 12347764 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-01 |
| 12341091 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-06-24 |
| 12327772 | Semiconductor package including stress-reduction structures and methods of forming the same | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng, Chin-Hua Wang | 2025-06-10 |
| 12322666 | Package assembly lid and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-06-03 |
| 12308346 | Semiconductor die with tapered sidewall in package | Chin-Hua Wang, Shin-Puu Jeng, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh +1 more | 2025-05-20 |
| 12266635 | Semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-04-01 |
| 12261102 | Semiconductor package and method of forming the same | Li-Ling Liao, Che-Chia Yang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-03-25 |
| 12255078 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Po-Yao Lin, Chien-Sheng Chen, Shin-Puu Jeng | 2025-03-18 |
| 12255119 | Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-03-18 |
| 12249568 | Metallization structure | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-03-11 |
| 12237276 | Package structure | Po-Chen Lai, Chin-Hua Wang, Che-Chia Yang, Shu-Shen Yeh, Po-Yao Lin +1 more | 2025-02-25 |
| 12232307 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-02-18 |
| 12191272 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-01-07 |