Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406898 | Chip package structure with lid | Shu-Shen Yeh, Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12387991 | Manufacturing method of semiconductor package | Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-08-12 |
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2025-07-22 |
| 12368114 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12322703 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2025-06-03 |
| 12322704 | Package structure with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh | 2025-06-03 |
| 12266635 | Semiconductor device package having dummy dies | Shu-Shen Yeh, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-04-01 |
| 12261102 | Semiconductor package and method of forming the same | Li-Ling Liao, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-03-25 |
| 12237276 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin +1 more | 2025-02-25 |