Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387992 | Package and method for forming the same | Yu-Sheng Lin, Chien-Tung Yu, Chin-Hua Wang, Shin-Puu Jeng | 2025-08-12 |
| 12322703 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-06-03 |
| 12218080 | Package structure with reinforced element | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen | 2025-02-04 |