Issued Patents 2025
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381180 | Multi-chip packages and methods of forming the same | Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2025-08-05 |
| 12368142 | Double side integration semiconductor package and method of forming the same | Monsen Liu, Shang-Lun Tsai, Shin-Puu Jeng | 2025-07-22 |
| 12354940 | Redistribution layer structure with support features and methods | Monsen Liu, Shang-Lun Tsai, Shin-Puu Jeng | 2025-07-08 |
| 12355001 | Semiconductor package structure and method for forming the same | Yen-Chu Tu, Shang-Lun Tsai, Monsen Liu, Shin-Puu Jeng | 2025-07-08 |
| 12322742 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2025-06-03 |
| 12293974 | Photonics integrated circuit package | Feng-Wei Kuo, Chewn-Pu Jou | 2025-05-06 |
| 12293141 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2025-05-06 |
| 12272629 | Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials | Monsen Liu, Po-Ying LAI, Shang-Lun Tsai, Shin-Puu Jeng | 2025-04-08 |
| 12243800 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Chin-Hua Wang | 2025-03-04 |
| 12224266 | Semiconductor packages including passive devices and methods of forming same | Shin-Puu Jeng, Po-Yao Chuang | 2025-02-11 |
| 12218095 | Chip package structure having molding layer | Shin-Puu Jeng, Feng-Cheng Hsu | 2025-02-04 |
| 12218080 | Package structure with reinforced element | Shin-Puu Jeng, Po-Yao Lin, Chia-Hsiang Lin | 2025-02-04 |
| 12205861 | Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate | Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shin-Puu Jeng | 2025-01-21 |