Issued Patents 2025
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12379544 | Optical waveguide termination | Cheng-Tse Tang, Chia-Ju Yu, CHENG HSIAO | 2025-08-05 |
| 12379556 | Package structure having grating coupler and manufacturing method thereof | Feng-Wei Kuo, Hsing-Kuo Hsia, Chih-Wei Tseng | 2025-08-05 |
| 12313879 | Semiconductor device, photonic circuit and method for adjusting resonant wavelength of optical modulator | Lan-Chou Cho, Cheng-Tse Tang, Stefan Rusu | 2025-05-27 |
| 12310123 | Light detecting device, optical device and method of manufacturing the same | Lan-Chou Cho, Weiwei Song | 2025-05-20 |
| 12298565 | Optical device for coupling light and method for fabricating the same | Chan-Hong Chern, Chih-Chang Lin, Chih-Tsung Shih, Feng-Wei Kuo, Lan-Chou Cho +2 more | 2025-05-13 |
| 12298558 | Optical isolator integrated with optical devices | Cheng-Tse Tang | 2025-05-13 |
| 12293974 | Photonics integrated circuit package | Feng-Wei Kuo, Shuo-Mao Chen | 2025-05-06 |
| 12293141 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen | 2025-05-06 |
| 12293954 | Method of fabricating semiconductor structure with heating element | Chih-Tsung Shih, Stefan Rusu, Feng-Wei Kuo | 2025-05-06 |
| 12276836 | Optical waveguide apparatus and method of fabrication thereof | Chan-Hong Chern, Chih-Chang Lin, Min-Hsiang Hsu, Weiwei Song, Feng-Wei Kuo +2 more | 2025-04-15 |
| 12278259 | Systems and methods for shielded inductive devices | Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski | 2025-04-15 |
| 12272855 | Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials | Jiun Yi Wu, Chien-Hsun Lee, Fu-Lung Hsueh | 2025-04-08 |
| 12270854 | Benchmark device and method for evaluating a semiconductor wafer | Lan-Chou Cho, Stefan Rusu | 2025-04-08 |
| 12272637 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chen-Hua Yu, Feng-Wei Kuo | 2025-04-08 |
| 12243860 | Package structure, semiconductor device comprising grating coupler and reflector structure embedded in the dielectric layer | Feng-Wei Kuo | 2025-03-04 |
| 12245361 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chien-Hsun Lee, Fu-Lung Hsueh | 2025-03-04 |
| 12222554 | Fiber-to-chip grating coupler for photonic circuits | Feng-Wei Kuo, Lan-Chou Cho, Huan-Neng Chen | 2025-02-11 |