Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394684 | Die stacking structure, semiconductor package and formation method of the die stacking structure | Su-Chun Yang, Jih-Churng Twu, Jiung Wu, Chen-Hua Yu | 2025-08-19 |
| 12341081 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2025-06-24 |
| 12293991 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2025-05-06 |
| 12272637 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2025-04-08 |
| 12218089 | Packaged semiconductor device and method of forming thereof | Chen-Hua Yu, Kuo-Chung Yee | 2025-02-04 |