Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
JT

Jih-Churng Twu

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Dashulong, TW: #168 of 446 inventorsTop 40%
Overall (2025): #342,515 of 469,880Top 75%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12394684 Die stacking structure, semiconductor package and formation method of the die stacking structure Su-Chun Yang, Jiung Wu, Chih-Hang Tung, Chen-Hua Yu 2025-08-19