Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
SY

Su-Chun Yang

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Dashulong, TW: #168 of 446 inventorsTop 40%
Overall (2025): #202,429 of 469,880Top 45%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12394684 Die stacking structure, semiconductor package and formation method of the die stacking structure Jih-Churng Twu, Jiung Wu, Chih-Hang Tung, Chen-Hua Yu 2025-08-19