Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394684 | Die stacking structure, semiconductor package and formation method of the die stacking structure | Su-Chun Yang, Jih-Churng Twu, Chih-Hang Tung, Chen-Hua Yu | 2025-08-19 |