Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341081 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2025-06-24 |
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2025-04-15 |
| 12272616 | Heat-dissipating structures for semiconductor devices and methods of manufacture | Chen-Hua Yu, Yu-Sheng Huang, Shih-Chang Ku, Chuei-Tang Wang | 2025-04-08 |