Issued Patents 2025
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417991 | Chip stack structure with conductive plug and method for forming the same | Tso-Jung Chang, Shih-Ping Lin, Jeng-Shien Hsieh, Chih-Peng Lin, Chieh-Yen Chen +1 more | 2025-09-16 |
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai +1 more | 2025-09-09 |
| 12412799 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Fong-Yuan Chang, Chieh-Yen Chen | 2025-09-09 |
| 12345935 | Package assembly and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chen-Hua Yu | 2025-07-01 |
| 12341106 | Package structure | Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Che-Wei Hsu | 2025-06-24 |
| 12334457 | Integrated fan-out package | Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu | 2025-06-17 |
| 12327796 | Architecture for computing system package | Chen-Hua Yu, Chieh-Yen Chen, Chung-Hao Tsai | 2025-06-10 |
| 12322691 | Package structure and method of manufacturing the same | Chun-Lin Lu, Kai-Chiang Wu | 2025-06-03 |
| 12322705 | Chip package and manufacturing method thereof | Chen-Hua Yu | 2025-06-03 |
| 12315854 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Chieh-Yen Chen | 2025-05-27 |
| 12300575 | Semiconductor package and method | Chen-Hua Yu, Shih-Chang Ku, Chien-Yuan Huang | 2025-05-13 |
| 12278214 | Integrated circuit package and method | Chen-Hua Yu, Chieh-Yen Chen, Wei Ling Chang | 2025-04-15 |
| 12272616 | Heat-dissipating structures for semiconductor devices and methods of manufacture | Chen-Hua Yu, Tung-Liang Shao, Yu-Sheng Huang, Shih-Chang Ku | 2025-04-08 |
| 12272691 | Semiconductor and circuit structures, and related methods | Chang-Fen Hu, Shao-Yu Li, Kuo-Ji Chen, Chih-Peng Lin, Ching-Fang Chen | 2025-04-08 |
| 12266673 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Hsiu-Jen Lin | 2025-04-01 |
| 12218006 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Tin-Hao Kuo, Che-Wei Hsu | 2025-02-04 |
| 12191270 | Integrated circuit package and method of forming same | Wei Ling Chang, Chieh-Yen Chen, Chen-Hua Yu | 2025-01-07 |