Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |