Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2025-06-03 |