Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394686 | Semiconductor structure and manufacturing method thereof | Shou-Zen Chang, Ming-Han Liao | 2025-08-19 |
| 12354870 | Multilayer stacking wafer bonding structure and method of manufacturing the same | Shou-Zen Chang | 2025-07-08 |
| 12354921 | Wafer structure including probe marked test pads | Shou-Zen Chang, Ying-Tsung Chu, Ming-Hsun Tsai | 2025-07-08 |
| 12327777 | Semiconductor package structure and manufacturing method thereof | Shou-Zen Chang, Chi-Ming Chen | 2025-06-10 |
| 12322670 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2025-06-03 |
| 12322691 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Kai-Chiang Wu | 2025-06-03 |
| 12278149 | Through-substrate via test structure | — | 2025-04-15 |