Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414304 | 3D monolithic stacking memory structure with oxide-semiconductor field effect transistor and ferroelectric metal-insulator-metal storage capacitor | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2025-09-09 |
| 12394686 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu, Ming-Han Liao | 2025-08-19 |
| 12389613 | Semiconductor structure | Wei Wang, Michio Sakurai, Cheng-Yu Tsai | 2025-08-12 |
| 12354870 | Multilayer stacking wafer bonding structure and method of manufacturing the same | Chun-Lin Lu | 2025-07-08 |
| 12354921 | Wafer structure including probe marked test pads | Chun-Lin Lu, Ying-Tsung Chu, Ming-Hsun Tsai | 2025-07-08 |
| 12327777 | Semiconductor package structure and manufacturing method thereof | Chun-Lin Lu, Chi-Ming Chen | 2025-06-10 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Chao-Wen Shih | 2025-04-01 |
| 12266847 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2025-04-01 |