Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2025-06-03 |
| 12322691 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Chun-Lin Lu | 2025-06-03 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2025-04-01 |
| 12218035 | Barrier structures between external electrical connectors | Chia-Chun Miao, Shih-Wei Liang | 2025-02-04 |