Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2025-06-03 |
| 12322696 | Dual-mode wireless charging device | Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng, Hsien-Ming Tu | 2025-06-03 |
| 12218035 | Barrier structures between external electrical connectors | Chia-Chun Miao, Kai-Chiang Wu | 2025-02-04 |