Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374652 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Ching-Jung Yang | 2025-07-29 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2025-06-03 |